India should begin with chip packaging, testing before advanced manufacturing: Former NITI Aayog Member
New Delhi [India], June 25 (ANI): India should begin its semiconductor journey with packaging and testing operations before moving into advanced chip manufacturing, while scale, high-quality infrastructure and a robust electronics ecosystem will be critical to the sector’s long-term success, according to former NITI Aayog member Arvind Virmani
‘You cannot straight away start producing all kinds of semiconductors
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